Comparison electromagnetic shielding effectiveness between single layer and multilayer shields

Metals are particularly suitable as shielding material against electromagnetic fields (EMI) due to their high electrical conductivity, Copper is the most common material using in shielding due to the high electromagnetic shielding. In this paper, the mathematical model is used to simulate the electromagnetic shielding effectiveness (SE) of single layer copper (Cu), However, there are a few drawbacks to using metal as a shielding material. The weight of the `heavy' metal can be an issue in the case of full metal shielding especially in applications where mass should be as low as possible. A new multilayer arrangement low weight is obtained by smart stacking dielectric(epoxy) and conductive layers (Aluminum(Al) and Nickel(Ni)) can attenuate more waves than the single layer of copper due to its mismatch impedance between conductive films and air. This new multilayer arrangement structure which allows an effective absorption of electromagnetic waves radiation, and a selective reflection of desired wavelengths of the shield in the high frequency range that is not widely used in general cases.