A Novel Package Lid Using Mushroom-Type EBG Structures for Unintentional Radiation Mitigation

Conventional package lid induces additional unintentional radiation due to the resonances between the conventional metal lid and ground plane on package board. In this paper, a novel package lid is proposed based on the gap waveguide theory, which adopts mushroom-type electromagnetic bandgap structures to mitigate the increased unintentional emission. In addition, a scalable equivalent circuit model is presented as an assistance for designing the proposed package lid. Both the simulation and measurement results confirm that the proposed lid can significantly reduce the unintentional radiation within the specific frequency range as designed.