On-Chip Interference Generation Mechanisms From an Electromagnetic Perspective

The electromagnetic characterization of on-chip interference generation mechanisms provides new and valuable insights to deal with substrate coupling. In this paper, we describe interference generation from a new perspective that allows us to determine which are the dominant contributions to substrate coupling as a function of the substrate technology option, the device architecture, and the specific operational configuration. This approach is also used to assess the effectiveness of on-chip isolation structures as a function of the aggressor and different grounding strategies. From this analysis, design recommendations are derived to minimize substrate-induced interference.