PIN-PMN-PT single crystal composite and 3D printed interposer backing for ASIC integration of large aperture 2D array

High channel count, large area ultrasound arrays at fine pitch require close integration of transducer elements and ASIC electronics. Composites of single crystal material and non-conducting epoxy filler can be used to increase bandwidth. Direct bonding of the composite to the ASIC leads to acoustic mismatch and excessive ringing. A collimated connection block (i.e. an interposer) between the array elements and their respective ASIC connections can provide both acoustic attenuation and electrical interconnection. Here we present the implementation of an interposer backing using additive manufacturing processes and demonstrate integration of the interposer with a PIN-PMN-PT single crystal composite transducer array.