Novel through hole absorber for suppression of power noise, crosstalk and EMI

In this paper, novel through hole/embedded absorbers based on absorbing materials are used to suppress the cavity resonant effects of power delivery networks (PDNs) in printed circuit boards (PCBs). The proposed technique can substantially reduce PDN impedances and EMI, and improves the signal and power integrity of interconnects for computer and electronic system designs. The embedded absorbers can be implemented by drilling through holes or/and arbitrarily shaped slots in the PCB or package, and then filling in the holes/slots with absorbing materials. As an example, full wave simulations are performed and results show that the proposed technique significantly reduces PDN impedances and radiated electric fields from PCB, though it is generic technique for mitigating other issues including crosstalk which are caused by PDN cavity resonant effects.