A survey on modeling strategies for high-speed differential Via between two parallel plates

This paper presents a survey on physics-based modeling strategies for differential via in high-speed multilayer printed circuits (PCBs). Driven by the goals of accurate and efficient design, researchers have explored several approaches for differential via modeling, include π-type RLC circuit, differential transmission line with via-plate capacitance/effective dielectric constant and parallel plate impedance model. This survey provides overviews of these modeling strategies and comparisons by correlating mixed-mode S-parameter from HFSS. In particular, this paper then aims on building a generic parameterized and SPICE-compatible circuit model for designing differential via in a frequency range up to 40GHz.