Demonstration of 3-D SRAM Cell by 3-D Monolithic Integration of InGaAs n-FinFETs on FDSOI CMOS With Interlayer Contacts

In this paper, we demonstrate, for the first time, 3-D Monolithic integration of short-channel replacement metal gate InGaAs n-FinFETs on fully-depleted silicon-on-insulator CMOS, with TiN/W interlayer contacts. Top layer InGaAs nFETs feature raised source–drain and bottom layer CMOS has Si raised source–drain for nFETs, SiGe raised source–drain for pFETS, implants, silicide, and TiN/W plug contacts. Scaled gate length (
${\text L}_{\text g}$
) of 15 nm is achieved on bottom layer Si n- and pFETs, while the top layer InGaAs n-FinFETs are scaled to
${\text L}_{\text g}$
of 25 nm. A densely integrated 3-D 6T-static random access memory circuit with planar InGaAs nFETs stacked on Si pFETs is demonstrated by taking advantage of the interlayer contacts. This yields significant area reduction when compared with 2-D layouts.