Thru-load de-embedding method for millimeter wave transmission lines

This paper presents a new deembedding method for transmission lines at millimeter waves and beyond in silicon integrated technology. The proposed method is called “Thru-Load” de-embedding which is a simplification from “Half-Thru” de-embedding. In this method the pad or pad interconnects parasitics are modeled into a simple “Half-Thru”. The simulated and measurement results are presented for the fabricated S-CPW transmission line as device under test in Bi-CMOS 55 nm technology.