Effect of thermal cycling on electrical properties in 3D die level packaging

The current work characterizes the developed processing technology for 3-D die level packaging of hybrid systems. SU-8 has been used as the patternable interlayer dielectric between the device layers. We have studied the suitability of various epoxies for bonding the thinned dies and found EPO-TEK 377 epoxy to be the best one. The effect of thermal cycling on the electrical properties of each layer of the stack was characterized.