Statistical analysis of “Tail Bits” phenomena with defect clustering in RESET switching process of RRAM devices

Tail bits in the RESET process influence the distribution of resistive parameters, and will dramatically decrease the uniformity in high electric stimuli region. In this study, such phenomena can be explained as non-uniform distribution of defects in the insulating layer and high defects density in the bottleneck region of conductive filament (CF). Then departing from defects' distribution function, an improved statistical analysis is developed, exhibiting better feasibility than traditional Weibull method. Based on the results of statistical analysis, the predictable distribution of tail bits can be realized. Thus, targeted approaches at defect control are expected to implement on the improvement of RESET behavior in the future studies.