3DIC developments for high yield and reliability manufacturing

3D-IC has been recognized as one of the technology solutions from More than Moore. Xilinx's 3D-IC FPGA has been well adopted by the industry since the first Virtex®-7 2000T introduced in 2011. In particular recently, data center requires large volume of 3D-IC for its applications. To fulfill the high demand effectively the best way is to provide the high yield and reliability 3D-IC product supply. The authors would like to share Xilinx's 3D-IC development experiences by means of launching process learning vehicles, pursuing early stages reliability assessment, and optimizing the process baseline. All the development efforts paved the foundation for a robust production line. At the end, the potential future 3D-IC technology challenges are outlined.