Enhancement of CMOS THz imaging sensing by packaging technology | IEEE Conference Publication | IEEE Xplore

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Enhancement of CMOS THz imaging sensing by packaging technology


Abstract:

Terahertz imaging sensing provides numerous attractive applications in different areas, for example, biology and medicine. CMOS technology benefits an imaging system in l...Show More

Abstract:

Terahertz imaging sensing provides numerous attractive applications in different areas, for example, biology and medicine. CMOS technology benefits an imaging system in low cost and a small form factor. The technology advance is technically viable for circuit design in such high frequencies. Lossy silicon substrate, however, still degrades system performance. We will discuss the techniques of performance enhancement.
Date of Conference: 30 August 2017 - 01 September 2017
Date Added to IEEE Xplore: 21 September 2017
ISBN Information:
Conference Location: Seoul, Korea (South)

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