Study of epoxy molding compound with high dielectric constant

with the extending of the storage space capacity of semiconductor device, more and more important data in the business have been accumulated in the device. Thus, the security enhancement becomes the crucial thing must be solved. Fingerprint, due to its properties of “unique by individual” and “unchangeable through life” as well as free from entering password turns into the first choice of personal identification method. Epoxy molding compound (EMC) with high dielectric constant (Dk), as the supporting material of fingerprint authentication sensors becomes the research hotspot in the field. For the dielectric constant of the epoxy resin and phenolic resin were changeless with their structure change, more attempts have been carried out on changing the fillers of EMC. Nowadays, the most commonly used fillers are alumina and barium titanate. Here, we compared the epoxy molding compound filled with alumina and barium titanate, and found that with the increasing of the content of both alumina and barium titanate, the dielectric constant of epoxy molding compound increased, and the Dk value of EMC filled with all alumina was about 7, however EMC packed all with barium titanate possessed the Dk value as high as 25. Meanwhile, the thermal conductivity of EMC with increased with the loading level of alumina increase, and with the value as high as 2.6W/m.K. For the spherical structure of alumina, the EMC with alumina in disclosed better flowability than that with barium titanate in. At last, EMC filling with barium titanate was difficult to be colored, which needs more coloring agent than normal.