Construction analysis of flip chip package for aerospace application

Eight typical flip chip packages were adopted in this study, two domestic, six imported, and five of the six imported were models with experience of aerospace application. The construction and material of these flip chip packages were analyzed, and similarities and differences between the domestic and the imported packages were compared. Construction analysis criteria of flip chip package for aerospace application were summarized based on these results. The results of this study could play an important guiding role in construction analysis of aerospace flip chip package components.