Study the effect of the temperature on the PCB assembly and solder joints in the vehicle

The purpose of this paper is to study the temperature effect on the Print Circuit Board (PCB) and the solder joints in the vehicle under working condition of the engine. Thermal-stress test has been used to evaluate the reliability or fatigue life of the PCB using commercially available Finite Element Analysis software, ANSYS. The thermal deformation distribution of the PCB and stress of the solder joints can be obtained. The modal analysis was carried out under the thermal and normal condition. The frequency, mode shapes, deformation and stress were obtained. It is observed that the frequency of the overall PCB assembly was decreased under thermal condition as compared to that under normal condition. The position of maximum temperature was located around the top edge of solder joints, which was close to package. And the position of maximum deformation and stress was also located around the top edge of the solder joints, which was close to package. This paper obtains the thermal stress and thermal deformation of the PCB and solder joints in the vehicle and compare the frequency of the PCB assembly under the thermal and normal condition.