Compact model of microprocessor cooling system based on ambient circumstanes

The main goal of this article is to model the thermal transfer phenomenon in a system consisting of a heat source, a heat sink and an ambient by a simple electro-thermal model. The purpose of such modelling is to deliver a computational function of power which can be used to control an IC to achieve its maximum throughput. It is made possible by using an IC and heat sink sensors which communicate information about the IC and the heat sink temperature to the model and make it possible to precisely track the heat transfer in a time domain. This article shows an analytical form of power function and explains the calculations from which the power function is delivered. The last paragraph presents how the RC values were calculated and presents example of possible scenario of heat transfer.