An evaluation of components offset and solder spreadability using factorial experiments

This article presents a comparison of various modifications of surfaces of components and the methods of soldering and their influences on the lead-free solders [1]. The parameters studied were the spreadability of solder and offset components. These properties depend not only on the type of solder but also on the modifying of the surface of components. To evaluate a series of samples we used 3D microscope HAWK QC 5000 NIS Elements BR. The method for analyses of factor effects was chosen the statistical method of Developing of Experiments (DOE) [2]. This work would help to facilitate the selection of suitable material combinations for achieving the highest quality solder joint.