Material study for full-faced heating layers, integrated in printed circuit boards

Different materials which are suitable for heating the complete area of an electronic assembly when embedded within a printed circuit board (PCB) are studied in this work. The focus being, two foil type materials with a conductive layer and two paste materials with carbon filler. The suitability to integrate these materials in the process technology for PCB manufacturing is described and used to construct test samples for heating and perform preliminary tests.