A Study on the Fabrication of Electrical Circuits on Fabrics Using Cu Pattern Laminated B-Stage Adhesive Films for Electronic Textile Applications

In this study, fabrication of the metal circuits on fabrics was demonstrated by a novel lamination method using B-stage epoxy adhesive films with patterned metals. Copper foils were firstly attached to the B-stage adhesive films, and copper was patterned by conventional photolithography methods. And then the patterned Cu/adhesive films were laminated onto conventional cloth or fabric using a vacuum lamination method. First, the effects of lithography processes on the chemical stability of uncured epoxy adhesive films were investigated. Morphology of Cu/fabric structures was observed by optical microscope (OM) and scanning electron microscope (SEM). Furthermore, mechanical flexibility of the laminated Cu lines on fabrics were evaluated by a dynamic bending fatigue test. By optimizing adhesive curing properties and processes, patterned metal circuits on fabrics were successfully demonstrated for electronic textile applications.