The Comparison of Package Design and Electrical Analysis in Mobile Application

In the mobile phone market-driven trend, mobile phones are equipped with high definition display, low power consumption, and a thin and light body. As mobile phone body thickness keeps decreasing, many components should follow the trend, including display panel module, covering panel glass, phone case, battery, camera module, PCB, IC package...etc. In this paper, the fan-out wafer level package (FOWLP) opportunity is researched in mobile application, and compared with traditional package solutions, including package structure, design and its electrical performance, the IC package of application processor (AP) and power management IC (PMIC) as the focus of this study. For the application processor (AP) study, the thickness of fan-out package on package (FOPoP) is about 35% less than MAPPoP, the signal/power integrity of FOPoP is about 15-85% better than MAPPoP. For the power management IC (PMIC) study, the outstanding advantages of fan-out chip last package (FOCLP) and fan-out system-in-package (FOSiP) are its thickness, thermal performance, and integration. The fan-out wafer level package (FOWLP) has good opportunity to be applied in mobile phones, which introduces the advantages of package form factor, high density integration and good performance [1].