Scalability and Yield in Elastomer Stamp Micro-Transfer-Printing

Elastomer stamp micro-transfer-printing is a highly scalable method for the assembly of microscale components onto non-native substrates. One of the key value propositions of micro-transfer-printing is that the transfer stamp can be scaled to wafer-dimensions and can transfer tens to thousands of micro-devices in a single step, equating to multiple millions of units per hour. Here, we report on the results of systematically scaling the stamp from 12.8 mm × 12.8 mm to a full 150 mm stamp, capable of transferring all the required devices to a 150 mm receiving wafer in one operation. The 150 mm stamp is designed to transfer more than 80,000 chips in one print cycle. This study was carried out using silicon nitride test vehicles that were specially designed for this project. We will discuss how stamp scaling impacts transfer yield and the implications for ultra-high throughput assembly of micro-devices. In addition, we will explore the capability to transfer very small devices down to 3 μm × 3 μm.