Package-Level Si Micro-Fluid Cooler with Enhanced Jet Array for High Performance 3D Systems

The Si micro-fluid cooler, combining micro-jet array impingement, micro-channel flow and micro-trench drainage, has been designed and experimentally evaluated. Enhanced jet array impingement has been achieved by eliminating the negative cross-flow effect among adjacent nozzles. Low thermal resistance <;0.1Kcm
²
/W and temperature variation rate of chip <;2% were achieved by using the developed micro-fluid cooler. Integrated with the developed micro-fluid cooler, liquid cooling module has been designed for 3D package. 3 cooling solutions have been studied. Double-side cooling module effectively enhanced both top side and bottom side thermal paths for heat removal of the stacked structure. High heat flux dissipation and uniform cooling performance have been achieved with the new liquid cooling module.