Next Generation High-Q Compact Size IPD Diplexer for RF Frond End SiP

It is demonstrated that the high quality factor with multi-layers of thick metal spiral inductors and low harmonics power level can be achieved by using a mature glass substrate technology. The thicker copper metal stacking for inductor is greater than 30 μm. The quality factor of inductors can achieve 70-100 in this study. In addition, the compact size of RF diplexer with thicker copper layer applied on WiFi SiP module is also demonstrated. The wifi module thickness should be below 1.1mm within 10×5mm area on coreless substrate. In order to reduce component size, the diplexer uses 2 layers of thicker metal as high-Q spiral inductor. After design optimization, the diplexer size can be reduced from 1.6mm×0.8mm to 1mm×0.5mm and cost can be saved. It is very critical and beneficial with compact size diplexer for the WiFi SiP module of current and next generation's commercial mobile system application.