Thermal Bond Reliability of High Reliability New Palladium-Coated Copper Wire

Pd coated copper (PCC) wire and Au-Pd coated copper (APC) wire have been widely used in the field of LSI device. Recently, higher bond reliability at high temperature becomes increasingly important for on-vehicle devices. However, it has been reported that conventional PCC wire caused a bond failure at elevated temperatures. On the other hand, new-APC wire had higher reliability at higher temperature than conventional APC wire. New-APC wire has higher concentration of added element than conventional APC wire. In this paper, failure mechanism of conventional APC wire and improved mechanism of new-APC wire at high temperature were shown. New-APC wire is suitable for on-vehicle devices.