“FlexTrate ^TM” — Scaled Heterogeneous Integration on Flexible Biocompatible Substrates Using FOWLP

We have developed a novel fan-out wafer level packaging (FOWLP) technology for high-performance and scalable flexible and biocompatible substrates that we call FlexTrate™. We demonstrate the technology with the assembly of 1-mm-sqaure 625 (25 by 25) Si dielets on a biocompatible Polydimethylsiloxane (PDMS). By using the new FOWLP technology, die-die interconnects with a pitch of 10 mm or less were implemented on the array of the Si dielets embedded in the PDMS.