Integrated Antenna-in-Package on Low-Cost Organic Substrate for Millimeter-Wave Wireless Communication Applications

This work proposes a Yagi-Uda array with fan-like driver for millimeter-wave application. The proposed antenna array is built on a low-cost and low-loss multilayer organic substrate for flip chip ball grid array (FCBGA) package. The package size is 16 × 8 × 0.44 mm
³
. The proposed four-element antenna array results in a peak gain of 12 - 14.5 dBi at operating frequency band. The proposed antenna achieves both broadband and high gain characteristics for millimeter-wave application. The proposed antenna array is also used to develop a low-cost 60-GHz switched-beam antenna array with butler matrix network. This work provides a cost-effective approach to implement a switched-beam antenna array for fifth-generation mobile communications (5G), IEEE 802.11ad, such as smart phone, laptops, and wireless router.