Development of CPU Package Embedded with Multilayer Thin Film Capacitor for Stabilization of Power Supply

This paper proposes a method of improving power delivery in a CPU package substrate with multilayer thin film capacitors (TFCs). Because TFC embedded technology can reduce the inductance of power delivery path, it can stabilize the power supply to the CPU. Higher permittivity, thinner layer thickness and wider conductor plane area results in larger capacitance. To further stabilize the power supply, we developed a package structure with an embedded double TFC layer that can double the capacitance. The double TFC embedded package was formed by laminating two TFCs to the top and bottom of the core layers in a build–up substrate. Through verification using test vehicles, it was confirmed that electrical performance was significantly improved with the double TFC. Also, it was demonstrated that the criteria of the capacitance and insulation resistance were satisfied in the product reliability tests.