Numerical analysis of conformal shields for chip and package shielding

In this paper, we examine two shielding and grounding (GND) structures of conformal shields by using numerical simulation. The first case is about the number of GND pads of the conformal shield on a package. The second case is about the side-wall shielding of multilayered package's substrate. Numerical results show that the shielding performance is improved as the number of GND pads increases. In addition, the shielding of the package's side-walls can considerably increase the shielding performance of the conformal shield.