Innovative Design in IGBT Cold Plate

This article illustrates the features of U-cup fin heat sink and its comparison with conventional cylindrical pin-fin heat sink. U-cup fin heat sink primarily targets at high-end water cooling system, and aims to meet the critical cooling requirements that high power level devices needs, particularly for mobile devices like electric vehicles. As mobile devices generally built with compact structure and have limited space for thermal dissipation. By means of metal injection molding technique for copper, this research is able to produce a complex geometric part like U-cup fin heat sink. This heat sink design is featured by high thermal performance and low pressure drop. Besides, it shows its capability in effectively suppressing wake flow, and has less part weight. Via CFD analysis and empirical tests, both results indicate U-cup fin cold plate has better performance in heat transfer rate and pressure drop than conventional cylindrical pin-fin does.