Effect of precipitate interfacial bonding strength on mechanical behaviors in simple tension of [110] iron nanowire

This study investigates the effect of precipitate interfacial bonding strength on the mechanical behavior of Fe nanowire (NW) under simple tension in the [110] direction by molecular dynamic simulation. The results thus obtained that the weak bonding of interface between the precipitate and the Fe nanowire gets a void that was formed close to the precipitate in the tensile process, and plastic deformation occurred mostly close to the precipitate. Additionally, dislocations cannot shear off the hard precipitate, resulting in gradual void growth. Finally, the nanowire broke down around the precipitate and void. In case of high strength bonding of interface between the precipitate and the Fe nanowire, the dislocations can shear off the precipitate, blocking the motion of the dislocation, increasing precipitation strengthening.