Molecular dynamics simulation of nanoimprinting effects of silver thin films with impurities defects on copper substrate

In this study, molecular dynamics (MD) are used to simulate the nanoimprinting behaviors of Ag thin films with impurities using a cuboid diamond punch. The results of the simulation show that the imprinting topography of Ag thin films depends on the slip behaviors of dislocations. In the punch indenting process, dislocations would be interfered by impurities defects. In the drafting process, the forming holes appear spring back and micro plastic recovery phenomenon, and the impurities affect the both behaviors. Although the impurities can result in a bigger springback, a better surface roughness can be obtained.