Microreplicated CMP pad for RMG and MOL metallization

Microreplicated CMP pad is applied to W and Co buff CMP steps for topography and WiDNU reduction of RMG and MOL metallization. This new pad exhibits stable rates and low defectivity over extended life time without the need for diamond conditioner. It also demonstrates reduction in topography built-up at device level and die level, leading to remarkable reduction in topo-related defects for MOL local interconnects.