Nanometer-deep junctions with high doping concentration for Ge SDEs using solid source doping and flash lamp annealing

In recent years Solid Source Doping (SSD) has been considered as a viable option in fabricating advanced CMOS devices [1], especially for forming shallow and highly doped junctions for source drain extensions (SDE) while minimizing the damage to the devices [2]. Current scaled devices require diffusion control in the nanometer range in order to form shallow SDEs using SSD. Additionally, high doping concentrations are needed to lower the resistivity (see Fig. 1).