High thermal sintering die attach for power device

Solder paste material is widely used for power devices as a standard die attach adhesive. But current solder paste material is not suitable to support high power devices which are requiring large current and high voltage application because it has low thermal and electrical conductance property. The characteristics of good die attach material should have high thermal conductance and low coefficient of thermal expansion (CTE) to minimize thermo-mechanical stresses, high electrical conductance to handle large current, high temperature stability, high mechanical strength and resistance to fatigue failure. Solders of the Pb-Sn and Lead-free have relatively low electrical and thermal conductivity. We have performed evaluations to find optimum material with silver sintering concept to replace solder paste.