Technology roadmap overviews and future direction through technology gaps

The 2017 iNEMI Technology Roadmap will be released to industry April, 2017. This roadmap, like all iNEMI Roadmaps, is updated every two years and describes the future manufacturing technology needs of the global electronics industry for the next ten years. This cycle it discusses the major business and technology issues, paradigm shifts, emerging technologies and markets, technology gaps, and identified needs in each of 7 product segments as well as forecasting the technical evolution associated with 21 different areas that support these product area needs. The resulting gaps are identified between the product needs and technical capabilities. This paper discusses the “Packaging and Component Substrates Chapter” highlights and identifies the technical and business gaps and showstoppers to provide in depth assessments, including key drivers from both business and technology viewpoints, critical gaps, and areas of potential industry collaboration moving forward.