A theoretical modeling of CMP: A Monte-Carlo approach

We have developed a novel simulator for chemical mechanical planarization processes, based on the one variant of Monte-Carlo method. It implemented the several input parameters: pressure, diameters of abrasives, temperature, linear velocity of abrasives, and easiness to remove materials. This simulator reproduced the linear change in the amounts of the polished portions of materials with pressure*linear velocity. The probabilities to invoke (a) the adsorption/desorption of removal rate enhancers/suppressors, (b) oxidation of materials, (c) hydrolysis of materials, (d) dissolution of surfaces, and (e) deposition of dissolved materials were also be available in this simulator.