Improved analysis of NBTI relaxation behavior based on fast I–V measurement

In this paper, we propose a qualitative analysis of NBTI recoverable components measured on pFET devices issued from various ST Microelectronics (28nm FDSOI technology and 40nm SION or Bulk) technologies. NBTI degradation and recovery resulting from DC stress are measured at µs time scale. We observed similarities between temperature and Vg
recovery
dependencies on NBTI relaxation of SiON and FDSOI technologies. Then, we discuss the nature of one defect type responsible for the NBTI at early stage of relaxation.