Thermal power envelope for IoT modules

IoT space is very dynamic and there is a multidimensional matrix of end-customer use-cases possible with the same module. A simple spec of Tcasemax and Thermal Design Power (TDP) will no longer suffice for an accurate design of the system complexity. The basic principle in this paper is to create a standard temperature and power envelope based on two broad classification of use cases: Application Processing Only (AP) and Application + Communication Processing (AP+CP). The final curves will change based on the thermal limiters, the type of thermal solution used, stack-up details, etc. All analysis is done using a systematic system engineering approach.