High frequency modeling of interconnects in deep-submicron technologies

In this paper, we evaluate the suitable level of modeling for interconnects in deep sub-micron circuits. We propose high frequency models for transmission lines and crosstalk. Our method is based on the association of electromagnetic (EM) and electrical simulations. We validate the principle of this method by comparisons with time domain characterizations. In particular, we analyze the role of the ground configuration in the mechanisms of crosstalk.