An integrated sp3t rf MEMS switch

In this paper, a novel multi-port MEMS switch is investigated. The switch is integrated on a chip of size 500μm × 500μm, while maintaining a high isolation between all ports up to 40 GHz. Electromagnetic (EM) simulation results are presented to verify the proposed concept. The switch is fabricated using the Multi-user MEMS processes MUMPs for integration on an Alumina substrate using flip-chip technology.