Alternative dicing solution of Multi-Project Wafer (MPW) by Stealth Dicing

Multi-Project Wafer (MPW) is designed for cost saving and fast prototype but conventional Blade Dicing process is time consuming and high risk to cause die loss because repetitive Blade Dicing process. Stealth Dicing is an alternative solution of Blade Dicing, patterned by Hamamatsu Photonics, which has potential for MPW dicing solution. This paper presents first successful MPW dicing by Stealth Dicing instead of Blade Dicing which FT (Functional Test) yield has been proved. In this study, the team evaluated the process of MPW dicing by Stealth Dicing. During the evaluation, some phenomenon has been observed which damage MPW chips. This study has clarified the phenomenon and found solution for the damage. After solving the problem, the result shows that yield of Stealth Dicing and Blade Dicing are comparable and Stealth Dicing is able to be used on MPW.