Reinforced solder preforms for high-reliability and low voiding

The studies done on reinforced solder preforms show that they can help to improve the reliability of solder joints by providing a consistent solder joint bondline. The work also shows that the final thickness of the preform, the packing density of the stand-off material, and the thickness of the stand-off all can be adjusted to impact the amount of voiding in the solder joint. Through an optimized design of the reinforced preform, it is clear that this technology can produce high-reliability, low-voiding solder joints. This technology is probably more necessary when dealing with heavier components in which solder joint collapse could be excessive if not controlled. This technology allows a stand-off to be built in without incurring additional process steps by trying to use an additive process such as wire bond stitching to control the collapse of the solder.