Fabric-based fine pitch interconnect technology using anisotropic conductive films(ACFs)

In this paper, it will be presented that more than 300 um pitch metal patterns can be successfully formed on various fabrics by a pattern transfer method. And it was found out that the FOF interconnection with excellent electrical contact resistance, good adhesion strength, and reliability were obtained using optimized ACFs materials designed for fabrics interconnection applications. Finally the fine pitch metal circuit technology combined with the FOF technology can provide excellent technical solutions for realizing flexible wearable electronics.