Integrated microwave sensors in SiGe with antenna in package: From concepts to solutions

In recent years wireless sensor systems operating in the microwave and mm-wave range became more and more popular. Automotive radar sensors are still the driving force for the development of higher integrated mm-wave sensors and thus pave the way also for applications in completely new areas. Industrial and life-science applications often require special functionality, smaller size, lower-power consumption, higher accuracy, easier applicability and more imaging capabilities, which leads towards flexible multi-channel multi-mode systems-on-chip (SoC) with antenna-in-package (AiP) solutions. This contribution treats some basic principles of radar and frontend concepts with respect to integration and indicates parallels and differences to typical communication radio chips. With advances in the packaging-technology the handling of mm-wave components becomes much easier, allowing new application areas. The embedded wafer level ball grid array (eWLB) packaging technology serves as basis for the additional integration of an antenna. Finally, realized systems of integrated SiGe-based sensors covering frequencies up to 240 GHz are shown. As application results measurements from a low-cost AiP based mm-wave imaging sensor at 160 GHz are presented.