Optimized design and thermal/electrical characterization analysis of automotive power semiconductor switch modules using an inlay PCB

This paper proposes an optimized design plan through an electrical parasitic component analysis and thermal/structural analysis of automotive power semiconductor switch modules to which inlay PCBs are applied. In addition, a module was manufactured based on the analyzed contents to present comparatively analyzed results. We also proposed a design plan for optimization that can enhance overall performance through a structural rearrangement of the design.