Flip-chip interconnection EA-DFB laser module for 100-Gbit/s/λ application

We have developed a flip-chip interconnection technique to solve the problem of the degradation of the modulation bandwidth of an optical transmitter due to the parasitic inductance of bonding wire. And we have fabricated an LE-EA-DFB laser module that has a 3-dB bandwidth of 59 GHz thanks to our flip-chip interconnection technique. The fabricated optical receiver, which includes a wideband electrical amplifier, has a 3-dB bandwidth of 51 GHz. Using these optical modules with a 3-dB bandwidth of more than 50 GHz, we have obtained a bit-error rate of less than 2 × 10
⁻⁴
, which is an error-free condition using KP4 forward error correction, under 53.2-Gbaud 4-level pulse amplitude modulation (4-PAM) operation without an equalizer even after a 2-km transmission through single-mode fiber.