The characterization of solder ball strength fatigue in thermal cycling test

The delivery time of a semiconductor packaging product has developed in a very short time period due to the demanding of 3C electronics. It is a fact that liability test of an electronic package takes much time and cost, and is a key issue in delivery time for advanced electronic packages. Recently, BGA packages using SnPb alloy are popular because of its advantage of mechanical stability and good solder ability. However, lead related materials can cause hazer to human health and environmental pollution thus Union has started to implement regulations such as WEEE and RoHS to limit the amount of electrical and electronic waste materials contain toxic substances and restrict the use of lead related materials. Today lead-free solder using Sn/Ag/Cu has been developed and implanted in ball grid array (BGA) packages, and specific liability tests for this new materials are required before delivery to the market. Since thermal cycling test (TCT) is a necessary testing with time consuming that can cause delay of the products to the market. We present the evaluation of the shear strength of the solder ball with various testing parameters such as temperature different, dwell time, and cycle times in TCT, and to formulate the.