The problem of boundary data exchange in a hybrid computation of thermal fields in electronic equipment

The paper describes the results of common works of the Technical University of Lodz (TUL) and the Ecole Centrale de Lyon (ECL) to give the software for 3D simulation of sophisticated thermal problems in electronic equipment. Both the programs, one of them developed in TUL, the second one in ECL, are described, as are the boundaries that join them.