A compact IGBT electro-thermal model in Verilog-A for fast system-level simulation

In this work, the implementation of a compact electro-thermal model of a trench gate field-stop IGBT device is presented. The primary target is to address system-level mixed signal multi-domain simulation where the simulation time is a key factor for the usefulness of results. The methodology adopted provides a model suitable for use on both SPICE-only simulators, where thermal behavior is mapped to electrical quantities, and on a multi-domain environment, where heterogeneous physical domains are managed by a simulation engine. A comparison with real device characteristics is presented to show model accuracy and finally a simulation of an inverter circuit is investigated to highlight achievable performances.