New TCE-matched glass-ceramic multi-chip module. II. Materials, mechanical, and thermal aspects

For pt.I see ibid., p.647-51 (1989). A glass-ceramic multichip packaging technology is discussed. The module substrate material is a glass-ceramic (Corning 9641), which can be TCE (thermal coefficient of expansion) matched to silicon (3.4 p.p.m./ degrees C) and possesses a low dielectric constant